Cheng-Gong Han1,2,?, Xin Qian3,?, Qikai Li1,4, Biao Deng1, Yongbin Zhu1, Zhijia Han1, Wenqing Zhang5, Weichao Wang6, Shien-Ping Feng4, Gang Chen3,*, Weishu Liu1,2,*
南方科技大學(xué)劉瑋書教授，美國(guó)國(guó)家工程院院士、麻省理工學(xué)院教授陳剛
1 Department of Materials Science and Engineering, Southern University of Science and Technology, Shenzhen, Guangdong 518055, China.
2 Shenzhen Engineering Research Center for Novel Electronic Information Materials and Devices, Southern University of Science and Technology, Shenzhen, Guangdong 518055, China.
3 Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139, USA.
4 Department of Mechanical Engineering, The University of Hong Kong, Pokfulam, Hong Kong 999077, China.
5 Department of Physics and Shenzhen Institute for Quantum Science and Technology, Southern University of Science and Technology, Shenzhen, Guangdong 518055, China.
6 Department of Electronics and Tianjin Key Laboratory of Photo-Electronic Thin Film Device and Technology, Nankai University, Tianjin 300071, China.
? These authors contributed equally to this work.
